MT6365VMW IC

Product Details
Product Details:

- Part Number: MT6365VMW

- Related Family Siblings: MT6365VPW, MT6365

- Manufacturer: MediaTek Inc. (MTK)

- Function: Primary System Power Management Integrated Circuit (Main PMIC / PMU)

- Power Integration: 9 Synchronous Step-Down Buck Converters & up to 33 Low-Dropout (LDO) Linear Regulators

- Communication Interface: High-speed SPMI (System Power Management Interface) and I2C serial control

- Safety & Protection: Integrated Over-Voltage Protection (OVP), Over-Current Protection (OCP), Under-Voltage Lockout (UVLO), and Thermal Shutdown (OTP)

- Package Type: High-Density Fine-Pitch BGA (Ball Grid Array) / WLCSP

- Mounting Type: Surface Mount Device (SMD BGA Soldering / Reballing)

Usage:

- Comprehensive Power Delivery: Generates and distributes stabilized power rails (VCORE, VPROC, VDRAM, VIO, VSRAM) across the central application processor, LPDDR memory, UFS flash storage, and baseband subsystems.

- Target Devices (Multi-Brand Support):

* Xiaomi / Redmi / POCO: Redmi Note 11 (4G/5G MediaTek variants), Redmi 10 5G, POCO M4 Pro 5G, Redmi Note 11 Power

* Vivo / iQOO: Vivo Y72 5G, Vivo Y52 5G, Vivo Y33s 5G, Vivo V21e

* Realme / Oppo: Realme 8 5G, Narzo 30 5G, Oppo A55 5G, Oppo A74 5G

* Infinix / Tecno: Infinix Note 12 series, Hot 12/20 5G series, Tecno Pova / Camon series

* Other mid-range Android devices powered by MediaTek Dimensity 700 / 810 or Helio G-series SoCs.

- Common Fault Symptoms & Motherboard Diagnostics:

* Dead Phone (No Power / No Boot): Device fails to trigger power-on; draws 0.00A or hangs at minimal current (e.g. 0.03A–0.08A) on DC bench power supply.

* Buck Inductor Short Circuit: Short-to-ground detected on surrounding power coils (such as VPROC or VCORE lines), causing the PMIC to overheat instantly under voltage injection.

* Hang on Logo / Boot Loop: Unstable secondary LDO voltage outputs prevent the Android kernel from completing its hardware initialization.

* Solder Fatigue / Drop Damage: Physical impacts or heat stress fracture solder balls under this high-density BGA chip, requiring professional reballing or full IC replacement.