MT6357MRV IC

Product Details:

- Part Number: MT6357MRV (Marking: MT6357MRV)

- Family Architecture: MediaTek MT6357 PMIC Series

- Sibling Variants: MT6357CRV, MT6357V

- Manufacturer: MediaTek Inc. (MTK)

- Companion SoC Platforms: MediaTek Helio A22 (MT6761), Helio P22 (MT6762), Helio G25 / G35 (MT6765)

- Function: Primary Power Management Integrated Circuit (PMIC) with Integrated Audio Subsystem

- Key Functional Subsystems:

* Multi-Phase Synchronous Step-Down Buck Converters (VCORE, VPROC, VGPU, VMODEM, VDRAM / LPDDR3 & LPDDR4X)

* High-PSRR Low-Dropout Linear Regulators (Dedicated power rails for eMMC/UFS, Cameras, Fingerprint sensor, SIM, Wi-Fi/BT)

* Built-in Audio Codec Stage (Stereo DAC, Earphone Amplifier, Loudspeaker Driver, Mic Preamp)

* Hardware Power Sequencing Controller & 32.768 kHz RTC Crystal Driver

* Baseband Communication via Serial Peripheral Interface (SPI / I2C Control)

- Package Type: VFBGA-209 (209-ball Fine-Pitch Ball Grid Array, 7.0mm x 6.6mm)

- Stencil Compatibility: Amaoe MP1 / Universal MediaTek PMIC BGA Stencil (0.12mm)

- Recommended Solder Paste: 183°C Leaded Solder Paste

Usage:

- Core Power Management: Regulates system power bus into stable high-current buck supplies and peripheral LDO lines to initiate phone boot sequence.

- Target Devices & Compatible Models:

* Vivo: Vivo Y81 (1808 / V1732A), Vivo Y83, Vivo Y71 (MTK editions), Vivo Y12 / Y15 (select batches)

* Infinix / Tecno: Infinix Smart 5 (X657), Infinix Hot 9 Play, Tecno Spark 6 Go, Tecno Pop 4, Tecno Spark 5

* Huawei / Honor: Huawei Y6 (2019 / MRD-LX1), Honor Play 8A

* Xiaomi / Redmi: Redmi 6A / Redmi 6 (specific board revisions), Redmi 9A (select regional MTK boards)

* Motorola: Moto E6s (XT2053)

* Samsung: Galaxy A01 Core, Galaxy A02, Galaxy A10s (select production batches)

- Interchangeability (MRV vs CRV vs V):

* Physical Footprint: MT6357MRV, MT6357CRV, and MT6357V share the identical 209-pin ball grid array.

* Board Compatibility: On many Tecno, Infinix (e.g. X657), and Vivo boards, replacing MRV with CRV or base V functions properly. However, for sensitive boards (such as Huawei Y6 2019 or specific Redmi 6A revisions), using the matching MRV chip is strictly recommended to prevent unexpected restarts, camera rail dropouts, or charging current throttling.

- Common Fault Symptoms & Motherboard Diagnostics:

* Completely Dead Phone (0.00A or Static 0.01A–0.03A Hang): Device fails to trigger power-on; pressing power key draws 0.00A (broken RTC oscillator / PWRKEY line) or freezes at 0.02A (shorted secondary LDO rail).

* Auto MediaTek USB Port (BROM Mode): Handset screen stays unlit, but connecting via USB to PC immediately identifies as "MediaTek USB Port (COMxx)" because the CPU starts in ROM recovery mode while memory (eMMC/RAM) power rails are unpowered.

* Bootloop / Hang on Logo: Phone restarts at the brand boot logo under heavy CPU clock ramp due to weak solder balls or voltage sag across the VCORE / VPROC buck inductors.

* Audio Codec Failure: Loudspeaker, earpiece, or microphone stays mute after physical speaker replacement, caused by an internally damaged analog audio c